A 20Mm X 25M Double-Sided Adhesive Thermal Tape And 16 Heatsinks, Pc. Computer.
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United States
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United States
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Full refund available within 30 days
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PayPal accepted
PayPal Credit accepted
Venmo accepted
PayPal, MasterCard, Visa, Discover, and American Express accepted
Maestro accepted
Amazon Pay accepted
Nuvei accepted
Shipping options
Seller handling time is 3 business days Details
This reflects the seller's handling time and may not include time spent in transit.
If you have questions about shipping, please contact the seller.
No shipping price specified to CA
Ships from
United States
Offer policy
OBO - Seller accepts offers on this item.
Details
You can make your offer during the checkout process as long as you do not live in a state where marketplace facilitator tax laws exist.
Check your state.
Return policy
Full refund available within 30 days
Payment options
PayPal accepted
PayPal Credit accepted
Venmo accepted
PayPal, MasterCard, Visa, Discover, and American Express accepted
Maestro accepted
Amazon Pay accepted
Nuvei accepted
Item traits
Category: |
Thermal Management
|
Quantity Available: |
3 in stock
|
Condition: |
New
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Brand: |
ESUMIC
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UPC: |
723044454577
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Package Dimensions: |
6.22 X 5.51 X 1.89 Inches
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Item Weight: |
1.34 Pounds
|
Listing details
Seller policies:
|
View seller policies
|
Shipping discount:
|
Seller pays shipping for this item.
|
Posted for sale:
|
More than a week ago
|
Item number:
|
1728221173
|
A 20Mm X 25M Double-Sided Adhesive Thermal Tape And 16 Heatsinks, Pc. Computer.
Droduct description
* Specification : Cooler
* Material : Aluminum
* Color : silver
Product parameter introduction
# Heat sink spacing: 5mm.
# Number of fins: 16.
# Size: 100 * 100 * 18mm / 3.93 x 3.93 x 0.7 inches.
Tape
Dimensions: 20mm x 25m x 0.25mm.
Working temperature: -20?~120?.
Thermal conductivity: 1.5.
The package includes
: ?4 x 100x100x18mm aluminum radiator module.
?1 x 12mm x 25m x 0.25mm thermally conductive double-sided tape.
??Radiator module?The surface design minimizes cooling when in contact with air. 16 heat sinks increase the sealing area, thus ensuring better heat dissipation. ??Application?Computer, FET, IC, power amplifier, voltage regulator, MOSFET, SCR, etc. Make sure that the size and heat dissipation of the heat sink are suitable for your components. ??Tape characteristics?high thermal conductivity, strong insulation, strong adhesion, softness, pressure resistance, heat resistance, double conductive tape, etc. It is a powerful assistant to solve the heat dissipation problem of many electronic products. ??Thermally conductive tape? Thermally conductive tape has high thermal conductivity and insulation, and can be firmly connected to the radiator and IC chip. ??Easy to use?just stick to the surface of the object. Tear off the blue paper to firmly adhere to the heat source and radiator. Speed up heat dissipation.